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Aluminum
Nitride Terminations
AIN
packages directly replace existing BeO packages with comparable data in
the areas of RF performance, power dissipation, adhesion of metal and
resistive films, superior thermal performance, low dielectric constant (Er),
and electrical resistivity (Ohm-cm). All devices also available without lead or mounted on
flange.
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BeO
Free™ Ceramic Devices
Precision
Chip Devices
High
Power Devices
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Tru-Power - True RMS Power Sensor
This
true RMS passive surface mount power sensor is the newest in a line of
innovative products from Barry Industries. Three versions are available.
The specifications for each device are shown in Table 1. They are a
compact (150mils x 150mils) (3.81 mm x 3.81mm) thick film circuit capable
of directly measuring RF input with a dynamic range of 25dB. They are pin
for pin compatible with existing power sensors in the industry. A DC input
of 5V is required to bias the internal bridge circuitry with a typical
current draw of 2mA to 8mA. The power sensor has a minimum frequency
response of DC-3GHz. With no RF input power, the differential offset
voltage can range from 0mV to 40mV. Once RF input power exceeds the
threshold, a differential voltage corresponding to that power level is
produced and added to the offset voltage. The slope of the power-voltage
transfer curve is the same for all parts despite the initial offset
voltage. The differential voltage output from the power sensor is small
and will need to be passed through an instrumentation grade op-amp for
adequate voltage swings corresponding to the RF input power. Because of
the large dynamic range and the ability to directly measure RF power,
regardless of the modulation employed, the circuitry required to range the
input signal to linear range of the sensor is greatly simplified when
compared with other methods of measuring average power.
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CL50R0
Series Cable Load Assemblies
The
purpose of the Barry Custom Cable Load Assembly is to prevent the excessive
buildup of temperature in the vicinity of sensitive printed circuit boards. This
is accomplished by conducting current away from the circuit board assembly to a
remote point, such as the heat sinks incorporated into the chassis of amplifiers
and base station transmitters. Heat generated by resistive elements is then
dissipated safely away from the temperature sensitive devices.
Numerous cable lengths and power handling capabilities are available on both BeO
and BeO Fre substrates. Configurations are also available to permit vertical or
end-of-line mounting and a choice of connectors for attachment to the circuit
board.
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Custom
Thick Film Circuits
Barry Industries is a leader in thick film technology. Because of their high
degree of vertical integration, they are able to provide standard thick film
processes, along with state-of-the-art manufacturing capabilities, such as
Diffusion Patterning, Photo Patterning and Laser Via Drilling. This enables them
to attain extremely high circuit densities and up to 12 metal layers in
production.
Quality
Assurance:
Inspection system complies with MIL-STD-45208. Calibration system complies with
MIL-STD-45662. Test laboratory is capable of performing quality conformance
inspection using the methods of MIL-STD-202, MIL-STD-883 and MIL-R-55342. WE CAN
SOLVE YOUR THICK FILM PROBLEMS.
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